Summary: . From the look of it, I would guess the die is much more rectangular than the standard IPF die. You can just see a corner of the brown PCB sticking out from under the centre copper plate. Next up, is the newest thing in bling-bling heatsinks. Intel realized that if it was going to be putting monster heatsinks in cases, it should make them look good. With that in mind, it
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Image originally found here.